Telit Cinterion has announced that their 5G data cards and LGA (land grid array) modules portfolio will use snapdragon X72 5G modem-RF (radio frequency) system. This is example of two companies’ commitment to providing device OEMs (original equipment manufacturers) with recent technologies to differentiate and future-ready their consumer and enterprise products.
Snapdragon X72 is part of world’s 5G Modem-RF system family ready for 5G advanced, boosted with AI hardware acceleration to drive future of 5G in mobile broadband applications. Snapdragon X72 will help Telit Criterion’s customers to differentiate their devices for service providers and end-users that demand products with long lifecycles.
Telit Cinterion will use Snapdragon X72 for a portfolio that includes a global M.2 data card and two LGA modules, one for North America and other for use in Asia-Pacific (APAC), Europe, Middle East and Africa (EMEA) and South America. These high-performance modules support 4.4 Gbps (gigabits per second) peak downloads and 3.5 Gbps peak uploads, making them ideal for bandwidth-intensive applications such as fixed wireless access, mobile broadband, industrial IoT (internet of things), private 5G and 4K video. Support for OpenWRT (OPEN wireless router) allows modules to provide advanced networking features for a large range of routers, gateways and CPEs (customer premises equipments) for residential and enterprise use.
The recent Telit Cinterion data cards and modules currently in development streamline product advancement, making it simple to integrate external peripherals such as Wi-Fi (wireless fidelity) and ethernet transceivers, without need for costly adapter components. They also will enable OEMs to run their application software directly on data card or module, thus eliminating expense, board space and complexity of an external CPU (central processing unit).
Snapdragon X72 introduces a modem-RF architecture purpose-built for scalability. The recent converged mmWave-sub6 architecture and mmWave antenna module Qualcomm QTM565 help reduce hardware footprint, cost, design complexity and power consumption. Additionally, OEMs and Telit Cinterion customers can leverage Qualcomm advanced modem-RF software suite to further improve sustained performance across a large variety of consumer and enterprise experiences.
“Snapdragon X72 is designed to drive the next phase of 5G evolution enabled by advanced 5G features, which will help Telit Cinterion customers future-ready their devices. We’re excited to continue bringing our connectivity technology to Telit Criterion customers so they can take full advantage of 5G.” says Anand Venkataraman, director of product management, Qualcomm Technologies, Inc.
“For over two decades, Telit Cinterion and Qualcomm Technologies have partnered to provide device OEMs with early access to the latest and greatest technologies. We’re continuing that tradition by making the Snapdragon X72 our foundation for Telit Cinterion’s new portfolio of 5G data cards and LGA modules which will raise the bar for what’s possible and preferable in mobile-powered devices such as routers, gateways and CPEs.” says Marco Contento, vice president of product management, mobile broadband, Telit Cinter.
For more information on Telit Cinterion 5G portfolio, visit here.
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