Kigen and Tongxin Microelectronics have announced a GSMA (global system for mobile communications association)-certified consumer eSIM (embedded-SIM) solution for affordable customer premise equipment (CPE) solutions. CPE devices bridge the “last mile” in delivering 5G networks for businesses or households that lack connectivity or networks in motion.
This solution allows OEMs (original equipment manufacturers) to support the demand for greater diversity in 4G/5G CPE devices addressing the next billion connections.
Operator demand for 5G fixed wireless access (FWA) is driving the need for a multitude of CPE (customer premises equipment) form factors. This includes indoor, rooftop, wall-mounted, or portable and battery-operated CPE devices. 5G FWA has arrived in countries such as India, Mexico, Nigeria, the Philippines, and South Africa.
“Global 5G FWA CPE cumulative revenues are expected to reach over $100 billion between 2020-2030,” says Neil Shah, VP of research at Counterpoint technology and research, “Bringing down the total cost of 5G FWA CPE is integral to 5G broadband adoption, scale and return on investment for all stakeholders in this price sensitive segment.”
The joint solution is based on Kigen’s Consumer eSIM OS, a compact size eSIM OS, on TMC’s THD89 series eSIM chipset, available as a smaller WLCSP package and using Kigen Remote SIM provisioning platform for IoT devices. This combines Kigen’s eSIM proposition and TMC’s security IC skill for:
- Easy installation: Simple field setup workflow to onboard new devices with profile download via an accompanying app.
- CPE management: Better IT or admin experience through digital profile downloads for activation or switching profiles.
- Driving innovation: OEMs can focus on value-added services through streamlined fleet management.
This joint solution is sampling with customers addressing retail point of sale (POS), smart metering, and logistics eSIM applications with CPE devices.
“CPE devices are a catalyst for much larger, global deployments of the 5G roll-out and an absolutely critical requirement to ensure a great return on the 5G investment,” says Vincent Korstanje, CEO of Kigen. “Kigen’s focus on energy efficient security OS for IoT now extends to the consumer market and brings time-to-market advantage in combination with TMC’s chip expertise to scale fast.”
“We are excited to partner with Kigen to deliver an eSIM solution to our customers,” says John Zou, vice GM of TMC. “The eSIM solution will enable device makers to provide their customers with global connectivity without the need for changing physical SIM cards. This will make it easier for device makers to sell products in multiple countries.”
This CPE solution is available now, and interested OEMs can see it during MWC Shanghai 2023 during 28-30 June 2023. For more information, please visit Kigen or Tongxin Microelectronics.
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