I-PEX, a provider of field of high-frequency and high-speed transmission connectors and Teramount Ltd, a provider of silicon photonics fibre packaging, have announced that they are collaborating to advance silicon photonics optical detachable connectivity for data centres and for other high-speed datacom and telecom applications.
The ever-growing demand for high bandwidth, low power and low latency in networking and advanced computing applications has led to growing adoption of silicon photonics, and for a continuous need to connect more and more optical fibres to silicon chips. That connectivity needs to be reliable, reworkable, serviceable, and cost-effective, which creates a huge challenge. The collaboration between I-PEX and Teramount will provide a solution of detachable fibre to chip connectivity based on Teramount’s self-aligning optics technology and I-PEX’s ultra-precision plug and holder systems.
“Detachable fibre connectivity to silicon photonic chips is a game changer for the industry. We have recently seen a growing number of customers who are interested in Teramount’s Detachable Photonic Plug for their silicon photonics applications, as it enables a new era of serviceable and reliable fibre connectivity solutions” says Hesham Taha, chief executive officer. “I-PEX is a leader in the connector industry, and we are thrilled to partner with them to advance our technology to high volume industrial grade level manufacturing”
“We are very pleased to support the realisation of Teramount’s Detachable Photonic Plug concept with I-PEX’s ultra-precise design and manufacturing capabilities” says Koichi Fujii, general manager, marketing of I-PEX. “We look forward to working with them to help penetrate silicon photonics solutions into data centres and other applications”
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