Security evaluation for IoT products supported by EMVCo

Global technical body, EMVCo has confirmed its security evaluation methodologies and processes support Internet of Things (IoT) payment use cases, enabling emerging solutions and devices to be evaluated quickly and

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FIME accredited for EMV Contactless Interface 3.0 migration

FIME reports that its testing laboratories have been accredited by EMVCo for EMV Contactless Interface v3.0.

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2018 trends: Safer data, faster payments, better experiences

Fundamental shifts in consumer behavior, the emergence of new technologies and an evolving regulatory landscape means the payments ecosystem is poised for unprecedented transformation in 2018. The demand for safer

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Beat the Black Friday blues with faster payments and safer data

Black Friday marks the start of the holiday shopping season. This is the most important time of the year for many retailers, and can account for up to 30% of

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EMVCo launches EMV Secure Remote Commerce technical framework

Technical body EMVCo has publicly released EMV® Secure Remote Commerce (SRC) – Technical Framework version 1.0. The framework describes the roles, high level processes and data descriptions that enable card

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EMVCo enhances EMV 3-D Secure specification

Technical body EMVCo has publicly released EMV® 3-D Secure – Protocol and core functions specification v2.1.0. The updated document follows the release of version 2.0.0 in October 2016, and includes

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NXP unveils breakthrough innovations for payment cards

NXP Semiconductors N.V. debuted two significant technology breakthroughs at the largest fintech innovation event, Money 20/20, October 22-25, 2017, in Las Vegas. The company will showcase its new contactless fingerprint-on-card

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2015 was the year that Fintech hit form

What a difference 12 months can make. Industry conversations at 2014’s Mobey Day, Mobey Forum’s annual open conference for all mobile money stakeholders, told of an industry undergoing major disruption.

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